Introduction
1.1 Background and Motivation
There has been a significant increase in the importance of miniature parts in recent years. The forerunner of this technology was mostly the electronics industry with their need of manufacturing processes for electronic components, like printed circuit boards and integrated circuits. The market of microsystem technologies is in general a very fast growing market. According to a study of the European NEXUS organization (Network of Excellence in Multifunctional Microsystems), the worldwide market for microsystem technologies is growing at an average rate of 18% a year to a total of $38 billion in 2002. However, the focus of the development is distributed different in certain countries. While the US has for example a focus on parts for micro-electro-mechanical systems (MEMS), equipment for information technology, biomedicine and genetic engineering, Germany dominates in sensor technology for the automotive industry. Japan has traditionally a strong position in fine mechanics and precision engineering as well as in equipment for information technology and consumer goods.
Until recently, the production of miniature components was focused on technologies, traditionally used in the electronics and semiconductor industry, like etching and other photofabrication techniques. Using these technologies extremely small feature sizes can be produced. Optical lithography for example produces features as small as 0.18 um and X-ray lithography can be used to produce even smaller features. Table 1.1 gives an overview of some of the methods which can be used for the production of miniature parts. An introduction to these techniques is given in some papers which brie y summarize different micromachining methods. A very good paper was published by Masuzawa. The most complete description of different processes is included in the book "Fundamentals of microfabrication: the science of miniaturization" by Marc J. Madou. Some other papers summarizing different micromachining methods are for example.
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Inhaltsverzeichnis (Table of Contents)
- Chapter 1 Introduction
- 1.1 Background and Motivation
- 1.2 Research Objective, Scope, and Research Plan
- 1.3 Thesis Content
- Chapter 2 Laser Machining
- 2.1 Introduction
- 2.2 Laser Parameters
- 2.3 CO2 Lasers
- 2.3.1 Introduction
- 2.3.2 Costs
- 2.3.3 Capabilities
- 2.3.4 Industrial Applications
- 2.4 ND:YAG Lasers
- 2.4.1 Introduction
- 2.4.2 Capabilities
- 2.4.3 Industrial applications
- 2.4.4 Costs
- 2.5 Excimer Lasers
- 2.5.1 Introduction
- 2.5.2 Techniques
- 2.5.3 Capabilities
- 2.5.4 Industrial Applications
- 2.5.5 Costs
- 2.6 Femtosecond Lasers
- 2.6.1 Introduction
- 2.6.2 Ablation process
- 2.6.3 Techniques
- 2.6.4 Capabilities
- 2.6.5 Industrial Applications
- 2.6.6 Costs
- 2.7 Conclusion
- Chapter 3 Mechanical Machining
- 3.1 Introduction
- 3.2 Tool Materials
- 3.2.1 Diamond
- 3.2.2 Tool Steel and Tungsten Carbide
- 3.3 Microdrilling
- 3.3.1 Drilling Machines
- 3.3.2 Drills
- 3.3.3 Cutting Process
- 3.3.4 Capabilities
- 3.3.5 Industrial Applications
- 3.3.6 Costs
- 3.4 Micro-Turning
- 3.4.1 Turning Machines
- 3.4.2 Turning Tools
- 3.4.3 Difficulties of Microturning
- 3.4.4 Cutting Process
- 3.4.5 Development of a micro-lathe
- 3.4.6 Capabilities
- 3.4.7 Industrial Applications
- 3.4.8 Costs
- 3.5 Micromilling
- 3.5.1 Milling Machines
- 3.5.2 Milling Tools
- 3.5.3 Cutting Process
- 3.5.4 Development of a meso-scale milling machine
- 3.5.5 Capabilities
- 3.5.6 Costs
- 3.5.7 Industrial Applications
- 3.6 Conclusion
- Chapter 4 Microforming
- 4.1 Introduction
- 4.2 Microforming Techniques and Capabilities
- 4.2.1 Extrusion
- 4.2.2 Cold Forging
- 4.2.3 Deep Drawing
- 4.2.4 Embossing/Coining
- 4.2.5 Air Bending
- 4.2.6 Blanking and Punching
- 4.3 Forming Process
- 4.3.1 Material Behavior
- 4.3.2 Friction
- 4.4 Machines
- 4.5 Forming Tools
- 4.6 Costs
- 4.7 Conclusion
- Chapter 5 Micro Electro-Discharge Machining (Micro-EDM)
- 5.1 Introduction
- 5.2 Principles of Material Removal in EDM
- 5.3 Factors influencing the Micro-EDM Process
- 5.4 Micro-EDM Techniques
- 5.4.1 Micro Electro-Discharge Die-Sinking
- 5.4.2 Micro Electro-Discharge Drilling
- 5.4.3 Micro Wire Electro-Discharge Machining
- 5.4.4 Micro Wire Electro-Discharge Grinding
- 5.4.5 Micro Electro-Discharge Grinding
- 5.4.6 Micro Electro-Discharge Milling
- 5.4.7 Uniform Wear Method
- 5.4.8 Summary of the Machining Techniques
- 5.5 Capabilities
- 5.5.1 Micro Electro-Discharge Die-Sinking
- 5.5.2 Micro Electro-Discharge Drilling
- 5.5.3 Micro Wire Electro-Discharge Machining
- 5.5.4 Micro Wire Electro-Discharge Grinding
- 5.5.5 Micro Electro-Discharge Grinding
- 5.5.6 Micro Electro-Discharge Milling
- 5.5.7 Uniform Wear Method
- 5.6 Machines
- 5.7 Industrial Applications
- 5.8 Costs
- 5.9 Conclusion
- Chapter 6 Conclusion
- 6.1 Summary and Comparison
- 6.2 Process Selection
- 6.3 Research and Application Issues
Zielsetzung und Themenschwerpunkte (Objectives and Key Themes)
The primary objective of this thesis is to conduct a comparative study of various micromachining processes, analyzing their capabilities, costs, and industrial applications. The research aims to provide a comprehensive overview of the current state-of-the-art in micromachining and to identify potential areas for further research and development.
- Capabilities of various micromachining processes.
- Costs associated with different micromachining technologies.
- Industrial applications of micromachining in various sectors.
- Comparison of the strengths and weaknesses of different micromachining techniques.
- Potential research and development directions for future advancements in micromachining.
Zusammenfassung der Kapitel (Chapter Summaries)
This section provides summaries of the main content of the chapters without revealing any major conclusions or spoilers.
- Chapter 1: Introduction - This chapter introduces the research context, including the background and motivation for the study. It defines the research objective, scope, and research plan. The chapter also outlines the structure and content of the thesis.
- Chapter 2: Laser Machining - This chapter presents a detailed analysis of laser machining techniques, including CO2 lasers, Nd:YAG lasers, excimer lasers, and femtosecond lasers. It discusses their capabilities, costs, and industrial applications.
- Chapter 3: Mechanical Machining - This chapter focuses on mechanical machining processes, including microdrilling, micro-turning, and micromilling. It explores the principles of these techniques, their capabilities, and their limitations.
- Chapter 4: Microforming - This chapter delves into the realm of microforming techniques, examining processes such as extrusion, cold forging, deep drawing, embossing, air bending, and blanking. It discusses the challenges and advancements in this area.
- Chapter 5: Micro Electro-Discharge Machining (Micro-EDM) - This chapter provides a comprehensive overview of Micro-EDM, explaining its principles, techniques, and applications. It analyzes the capabilities and limitations of various Micro-EDM methods.
Schlüsselwörter (Keywords)
This thesis explores various aspects of micromachining, encompassing key topics such as laser machining, mechanical machining, microforming, and micro electro-discharge machining (Micro-EDM). The research focuses on understanding the capabilities, costs, and industrial applications of different micromachining processes, aiming to contribute to the advancements in this field.
- Quote paper
- Anonym (Author), 2002, Comparative Study of the Capabilities of Various Micromachining Processes, Munich, GRIN Verlag, https://www.grin.com/document/7556