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bleifrei
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Flip Chip Bonding mit Umstellung auf bleifreie Lotmaterialien
Fachübergreifende Studienarbeit
Autor:in:
Dipl.-Ing. Jens Markusch (Author)
Subject:
Electrotechnology
Category:
Research Paper (undergraduate) , 2006 , Grade: sehr gut
Price:
US$ 31.99
Flip Chip Bonden - Umstellung auf bleifreie Lotmaterialien
Autor:in:
Marcel Wittek (Author)
Subject:
Electrotechnology
Category:
Research Paper (undergraduate) , 2006 , Grade: 1,0
Price:
US$ 31.99
