Sungwon Chung

SungWon Chung is Research Associate in the Department of Electrical Engineering at the University of Southern California (USC), Los Angeles, CA, USA. He received the Ph.D. degree in Electrical Engineering and Computer Science (EECS) from the Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, in 2014, followed by the M.S. degree in EECS from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 2005 and the B.S. degree in Electronics Engineering with double major in Computer Engineering and minor in Mechanical Engineering from Pusan National University, Busan, Korea, in 2002. His research interests are in the broad range of innovative system architectures and integrated circuits for nanodevices exploiting diverse wave-matter interactions. Prior to his present appointment, he had held R&D positions for five years in Mitsubishi Electric as Consultant, KITEL Company as Member of Technical Staff, MIT Microsystems Technology Laboratories as Postdoctoral Associate, and Intersil Corporation (acquired by Renesas Electronics) as Mixed-Signal Design Engineering Intern. He is presently collaborating with industry partners for the development of on-chip large-scale phased arrays and digital transmitters. Dr. Chung serves on the Digital Signal Processing Technical Committee (MTT-9/DSPX) for IEEE Microwave Theory and Techniques Society (MTT-S) where he is co-organizing workshops for IEEE International Microwave Symposium (IMS) and IEEE Radio Frequency Integrated Circuits Symposium (RFIC). He received IEEE Computer Society Lance Stafford Larson Outstanding Paper Award, IEEE Radio and Wireless Week Best Paper Award, Samsung Electronics Thesis Award, and was nominated for IEEE International Microwave Symposium (IMS) Best Paper Award. He was a Viterbi Postdoctoral Fellow and a Presidential Scholar, and is a recipient of 2014 Outstanding Student Designer Award from Analog Devices. His research work on an energy-efficient microwave transmitter was commercialized by Eta Devices (acquired by Nokia Corporation) and recognized with 2015 Technology Pioneers Award by World Economic Forum (WEF) in Geneva, Switzerland. Dr. Chung and his two colleagues were awarded Bell Labs Prize for their work on large-scale nanophotonic phased arrays demonstrated in 2017 IEEE International Solid-State Circuits Conference (ISSCC) for 3D imaging, sending, and communication.