Biographie
wissenschaftliche Veröffentlichungen:
Konferenzbeiträge:
2014
P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, “TSV-Annealing : A thermo-mechanical assessment,” in Electronics System-Integration Technology Conference (ESTC), 2014, pp. 1–6.
2013
P. Saettler, M. Boettcher, C. Rudolph, and K. J. Wolter, “Bath chemistry and copper overburden as influencing factors of the TSV annealing,” in Proceedings - Electronic Components and Technology Conference, 2013, pp. 1753–1758.
P. Saettler, M. Boettcher, and K. J. Wolter, “µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery,” in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, 2013, pp. 1–7.
2012
P. Saettler, M. Boettcher, and K. J. Wolter, “Characterization of the annealing behavior for copper-filled TSVs,” in Proceedings - Electronic Components and Technology Conference, 2012, pp. 619–624.
P. Saettler, D. Kovalenko, K. Meier, M. Roellig, M. Boettcher, and K. J. Wolter, “Thermo-mechanical characterization and modeling of TSV annealing behavior,” in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012, pp. 1/6–6/6.
2011
P. Saettler, K. Meier, and K. J. Wolter, “Considering copper anisotropy for advanced TSV-modeling,” in Proceedings of the International Spring Seminar on Electronics Technology, 2011, pp. 419–423.
Fachzeitschriften:
2015
P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, “µ-Raman Spectroscopy and FE-Modeling for TSV-Stress-Characterization,” Microelectron. Eng., pp. 1–7, 2015.
2013
P. Saettler, M. Boettcher, C. Rudolph, and K.-J. Wolter, “Thermo-mechanische Charakterisierung des TSV-Annealing,” Produktion von Leiterplatten und Syst., no. 7, pp. 1498–1507, 2013.
Konferenzbeiträge:
2014
P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, “TSV-Annealing : A thermo-mechanical assessment,” in Electronics System-Integration Technology Conference (ESTC), 2014, pp. 1–6.
2013
P. Saettler, M. Boettcher, C. Rudolph, and K. J. Wolter, “Bath chemistry and copper overburden as influencing factors of the TSV annealing,” in Proceedings - Electronic Components and Technology Conference, 2013, pp. 1753–1758.
P. Saettler, M. Boettcher, and K. J. Wolter, “µ-Raman spectroscopy and FE-analysis of thermo-mechanical stresses in TSV periphery,” in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013, 2013, pp. 1–7.
2012
P. Saettler, M. Boettcher, and K. J. Wolter, “Characterization of the annealing behavior for copper-filled TSVs,” in Proceedings - Electronic Components and Technology Conference, 2012, pp. 619–624.
P. Saettler, D. Kovalenko, K. Meier, M. Roellig, M. Boettcher, and K. J. Wolter, “Thermo-mechanical characterization and modeling of TSV annealing behavior,” in 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012, 2012, pp. 1/6–6/6.
2011
P. Saettler, K. Meier, and K. J. Wolter, “Considering copper anisotropy for advanced TSV-modeling,” in Proceedings of the International Spring Seminar on Electronics Technology, 2011, pp. 419–423.
Fachzeitschriften:
2015
P. Saettler, M. Hecker, M. Boettcher, C. Rudolph, and K. J. Wolter, “µ-Raman Spectroscopy and FE-Modeling for TSV-Stress-Characterization,” Microelectron. Eng., pp. 1–7, 2015.
2013
P. Saettler, M. Boettcher, C. Rudolph, and K.-J. Wolter, “Thermo-mechanische Charakterisierung des TSV-Annealing,” Produktion von Leiterplatten und Syst., no. 7, pp. 1498–1507, 2013.
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- 23.4.2016
