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(Results for »
Bond
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Flip Chip Bonden - Umstellung auf bleifreie Lotmaterialien
Author:
Marcel Wittek (Author)
Subject:
Electrotechnology
Category:
Research Paper (undergraduate), 2006
Price:
US$ 32.99
Flip Chip Bonding mit Umstellung auf bleifreie Lotmaterialien
Fachübergreifende Studienarbeit
Author:
Dipl.-Ing. Jens Markusch (Author)
Subject:
Electrotechnology
Category:
Research Paper (undergraduate), 2006
Price:
US$ 31.99